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SHANGHAI, April 29 /PRNewswire-Asia/ -- Semiconductor Manufacturing overseas corporation (NYSE: SMI; SEHK: 981) ("SMIC" or the "company"), one of the most leading semiconductor foundries on this planet, these days introduced its consolidated consequences of operations for the three months ended March 31, 2009.First Quarter 2009 Highlights: -- overall revenue diminished to $146.5 million in 1Q09, down with the aid of 46.2% QoQ from 4Q08 as a result of a 47.8% decrease in wafer shipments. -- Gross margin turned into -88.three% in 1Q09 compared to -27.four% in 4Q08 because of a huge decline in wafer cargo and fab utilization. -- The enterprise recorded a internet lack of $178.4 million in 1Q09, in comparison to a web lack of $139.5 million in 4Q08. -- regardless of a sharp discount in fab utilization, the company generated $seventy eight million of internet cash from operating activities in 1Q09. -- The enterprise has lined up new credit facilities totalling about $240 million. -- Simplified ASP expanded to $869 in 1Q09, up 3.1% QoQ from $843 in 4Q08 and up 8.9% YoY from $798 in 1Q08.
2nd Quarter 2009 tips:
the following statements are ahead looking statements which can be according to present expectation and which contain risks and uncertainties, a few of which can be set forth under "protected Harbor Statements" beneath.-- earnings is anticipated to raise fifty eight% to 62%. -- operating expenses aside from international alternate change are anticipated to latitude from $79 million to $83 million. -- Capital bills are anticipated to latitude from $38 million to $forty three million. -- Depreciation and amortization are expected to latitude from $203 million to $206 million
Commenting on the quarterly outcomes, Dr. Richard Chang, Chief executive Officer of SMIC, remarked, "within the first quarter our profits passed our outdated tips by 7.5%, and our quarterly ASP elevated 8.9% 12 months-over-yr. among the many total wafer income, logic items contributed 96.9%. We additionally witnessed huge month-over-month increases on wafer orders and fab movements seeing that chinese New 12 months. The mighty order recovery become driven partially by using the replenishment of depleted stock and additionally from extended demand in chinese home consumption on instant LAN, mobile phones, digital displays and other purchaser electronics. international shoppers proceed to make the most of SMIC's strategic position to capture the China market, which has experienced sooner healing because the starting of this year because of a lot of domestic stimulus courses backed by means of the chinese language government. We are expecting our 2d quarter 2009 utilization expense to double compared to the primary quarter.
From the advanced know-how entrance, our 45nm low-vigour know-how qualification growth is on-song and has shown qualification chip yield growth. We accomplished licensed know-how transfer from IBM on high-efficiency bulk-CMOS expertise last quarter and process qualification is in growth in our Shanghai 300mm facility. numerous valued clientele are engaged in our lead-customer partnership and design-in actions, in parallel with SMIC's silicon verification with IBM's confirmed 45nm technologies. moreover, 65nm consumer low-vigour product qualification is in its final stage. we're positioned to circulate into volume construction within the third quarter of 2009.
in the first quarter, we've obtained strong orders reflecting convalescing demand from 90nm and 130nm technology nodes. in addition, we see promising new tape-out actions in the first quarter, averaging multiple tape-out per day. We continue to forge more strategic alliances to superior serve our consumers; such as with Dolphin Integration for its extremely-low power digital-to-analog audio converters for the moveable Media participant market, and with FlipChip overseas for subsequent-era 300mm flip chip bumping and wafer stage packaging. We continue to be dedicated to participating with international partners to raise our product portfolio and repair scope.
within the first quarter of 2009, we generated $seventy eight million web cash from operating activities regardless of the challenging market circumstances. In March 2009, we signed a memorandum on strategic cooperation with China Export-Import financial institution ("China EXIM financial institution"), below which China EXIM financial institution intends to deliver complete credit score amenities up to RMB three billion (US$438 million) to SMIC. As part one of this cooperation, China EXIM bank has already authorised a $140 million 2-yr credit score facility to us. all the way through the first quarter of 2009, the enterprise has lined up new credit amenities totalling about $240 million, which includes the $one hundred forty million credit score facility spoke of above. This has tremendously bolstered our fiscal place.
Into the second quarter of 2009, we are encouraged by way of the increasing orders received. We assume about 60% quarter-over-quarter boost in income in the 2d quarter of 2009. we're hopeful that the worst is at the back of us, and we're working hard on all fronts to support our operational and financial efficiency as the general market continues to get better."conference call / Webcast Announcement Date: April 30, 2009 Time: eight:30 a.m. Shanghai time
Dial-in numbers and flow code: U.S. 1-617-614-3672 / 1-800-260-8140 or HK 852-3002-1672 (pass code: SMIC).
A reside webcast of the 2009 first quarter announcement should be obtainable at http://www.smics.com under the "Investor family members" section. An archived version of the webcast, along with an electronic replica of this information release might be accessible on the SMIC site for a period of one year following the webcast.
Semiconductor Manufacturing foreign employer ("SMIC"; NYSE: SMI; SEHK: 981) is likely one of the main semiconductor foundries in the world and the greatest and most advanced foundry in Mainland China, presenting built-in circuit (IC) foundry and expertise features at 0.35um to 45nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab below development in Shenzhen, and an in-residence meeting and checking out facility in Chengdu. SMIC also has client provider and advertising workplaces in the U.S., Europe, and Japan, and a consultant workplace in Hong Kong. in addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by means of Cension Semiconductor Manufacturing agency and a 300mm wafer fab in Wuhan owned with the aid of Wuhan Xinxin Semiconductor Manufacturing employer.For more advice, please talk over with http://www.smics.com . secure Harbor Statements (below the private Securities Litigation Reform Act of 1995)
This press liberate consists of, moreover old information, "forward-searching statements" inside the that means of the "secure harbor" provisions of the U.S. inner most Securities Litigation Reform Act of 1995. These ahead-searching statements, including statements regarding expected raise in our 2d quarter 2009 utilization cost, predicted timing for stepping into volume creation for 65nm client low vigour product, future collaboration with global companions, predicted future credit amenities, predicted boost in earnings in the 2nd quarter 2009, our expectations related to market restoration, our ability to fortify our operational and economic efficiency, our expectations regarding the amount of our capital expenditures in 2009, and statements under "Capex abstract" and "2nd Quarter 2009 tips", are according to SMIC's existing assumptions, expectations and projections about future activities. SMIC uses words like "trust," "expect," "intend," "estimate," "expect," "undertaking" and identical expressions to establish forward-searching statements, despite the fact not all forward-searching statements contain these phrases. These forward-searching statements are always estimates reflecting the optimal judgment of SMIC's senior management and involve large risks, both familiar and unknown, uncertainties and other factors that could cause SMIC's specific efficiency, financial condition or results of operations to be materially diverse from these advised through the ahead-looking statements including, among others, dangers associated with cyclicality and market situations in the semiconductor business, the downturn within the global financial system and the influence on China's economic climate, intense competitors, well timed wafer acceptance via SMIC's clients, well timed introduction of latest technologies, SMIC's skill to trap boom opportunities in China, SMIC's skill to enhance its items portfolio, deliver and demand for semiconductor foundry capabilities, business overcapacity, shortages in equipment, components and uncooked materials, orders or judgments from pending litigation, availability of producing capacity and financial steadiness in conclusion markets.
investors should believe the counsel contained in SMIC's filings with the U.S. Securities and change commission (SEC), including its annual file on 20-F, as amended, filed with the SEC on November 28, 2008, mainly within the "possibility factors" and "management's discussion and analysis of fiscal condition and effects of Operations" sections, and such other files that SMIC might also file with the SEC or SEHK from time to time, together with on form 6-okay. other unknown or unpredictable elements also might have cloth antagonistic results on SMIC's future effects, efficiency or achievements. In easy of those risks, uncertainties, assumptions and components, the forward-searching routine mentioned in this press unencumber may additionally not occur. you are suggested now not to region undue reliance on these forward-searching statements, which communicate most effective as of the date cited, or if no date is cited, as of the date of this press release. except as required by using legislations, SMIC undertakes no duty and does not intend to replace any forward-searching observation, no matter if because of new information, future hobbies or in any other case.
recent TSMC legal trends:
On August 25, 2006, TSMC filed a lawsuit in opposition t the business and certain subsidiaries, specifically SMIC (Shanghai), SMIC (Beijing) and SMIC (Americas) in the sophisticated court of the State of California, County of Alameda for alleged breach of a 2005 settlement contract, alleged breach of promissory notes and alleged exchange secret misappropriation with the aid of the enterprise. TSMC seeks, among different things, damages, injunctive aid, attorneys' costs, and the acceleration of the ultimate funds stunning under the settlement settlement.
within the existing litigation, TSMC alleges that the company has incorporated TSMC alternate secrets and techniques within the manufacture of the company's 0.13 micron or smaller process items. TSMC extra alleges that because of this claimed breach, TSMC's patent license is terminated and the covenant not to sue set forth within the 2005 contract settlement not in effect with respect to the business's larger procedure products. The company has vigorously denied all allegations of misappropriation. The court has made no discovering that TSMC's claims are valid.
On September 13, 2006, the enterprise announced that apart from submitting a response strongly denying the allegations of TSMC within the u.s. lawsuit, it filed on September 12, 2006, a cross-complaint towards TSMC in the hunt for, amongst other issues, damages for TSMC's breach of contract and breach of implied covenant of decent religion and reasonable dealing.
On November sixteen, 2006, the high court in Beijing, the americans's Republic of China, accepted the submitting of a complaint by means of the enterprise and its utterly-owned subsidiaries, namely, SMIC (Shanghai) and SMIC (Beijing), regarding the unfair competitors coming up from the breach of bona fide (i.e. integrity, respectable religion) precept and business defamation with the aid of TSMC ("PRC criticism"). in the PRC complaint, the business is in search of, amongst other things, an injunction to stop TSMC's infringing acts, public apology from TSMC to the enterprise and compensation from TSMC to the business, including gains won by using TSMC from their infringing acts.
On August 14, 2007, the company filed an amended go-complaint against TSMC seeking, amongst different things, damages for TSMC's breach of contract and breach of patent license contract. TSMC thereafter denied the allegations of the enterprise's amended pass-criticism and subsequently filed further claims that the business breached the agreement agreement by filing an action within the Beijing high courtroom. The company has denied these additional claims by using TSMC.
On August 15-17, 2007, the California court held a preliminary injunction listening to on TSMC's motion to enjoin use of definite system recipes in certain of the enterprise's 0.13 micron good judgment process flows.
On September 7, 2007, the court docket denied TSMC's preliminary injunction motion, thereby leaving unaffected the company's construction and revenue. youngsters, the court docket required the company to provide 10 days' strengthen observe to TSMC if the company plans to reveal logic expertise to non-SMIC entities below definite situations, to allow TSMC to object to the planned disclosure.
In might also 2008, TSMC filed a action within the California court docket for abstract adjudication towards the enterprise on several of the company's pass claims. The enterprise hostile the movement and on August 6, 2008, the courtroom granted partly and denied partially TSMC's motion.
On June 23, 2008, the enterprise filed within the California court a move-grievance against TSMC in the hunt for, amongst different issues, damages for TSMC's unlawful misappropriation of trade secrets and techniques from SMIC to improve its aggressive place against SMIC.
On July 10, 2008, the California court docket held a preliminary injunction hearing on TSMC's motion to enjoin disclosure of advice on certain system recipes in the company's 0.30 micron logic method flows to 3rd parties. On August eight, 2008, the court granted-in-half TSMC's movement and preliminarily enjoined SMIC from disclosing fourteen 0.30um method steps. On October 3, 2008, SMIC filed a notice of enchantment of the court docket's August eight, 2008 Order with the California court of enchantment. This attraction is presently pending.
right through the pre-trial lawsuits within the depend, questions arose related to the actual phrases of the 2005 agreement contract between SMIC and TSMC. for that reason, the California courtroom held a preliminary trial on January 13 to 16, 2009, restrained to a choice of the terms of the contract settlement and an interpretation of any requirements to "meet and confer" previous to establishment of litigation. On March 10, 2009, the court issued a press release of decision discovering, in part, that an contract between the events was achieved on January 30, 2005, and thereafter amended on February 2, 2005, as advised by means of TSMC. The court docket's ruling could be appealed with the aid of SMIC following the submitting of a remaining judgement by the court docket in this remember.
The California court has scheduled a trial upon all liability considerations regarding a particular list of TSMC exchange secret claims and SMIC exchange secret claims to begin on September eight, 2009.
within the company's action in the Beijing high americans's courtroom, following an unsuccessful problem to that court docket's jurisdiction via TSMC, the court docket has held evidentiary hearings on October 15, October 29, and November 25, 2008. There are no extra hearings scheduled by that courtroom and it's anticipated that the court docket will challenge a ruling in keeping with the proof presented to it.
below the provisions of SFAS 144, the enterprise is required to make a determination as as to whether or not this pending litigation represents an experience that requires an extra evaluation of whether the patent license portfolio has been impaired. We consider that the lawsuit is at a discovery stage and we're nevertheless evaluating no matter if or not the litigation represents such an event. The enterprise expects extra assistance to become obtainable to us, with the intention to support us in making a resolution. The result of any impairment analysis carried out under SFAS one hundred forty four could influence in a fabric impact to our financial position and outcomes of operations. because the case is in its discovery stage, the business is unable to evaluate the likelihood of an detrimental outcome or to estimate the volume or latitude of expertise loss.abstract of First Quarter 2009 working effects amounts in US$ heaps, other than EPS and operating records 1Q09 4Q08 QoQ 1Q08(three) YoY revenue 146,519 272,479 -46.2% 362,369 -59.6% charge of income 275,900 347,114 -20.5% 394,940 -30.1% Gross loss (129,381) (74,635) 73.4% (32,571) 297.2% operating costs 46,681 forty six,445 0.5% one hundred seventy,151 -72.6% Loss from operations (176,062) (121,080) 45.4% (202,722) -13.2% different costs, net (4,480) (4,146) eight.1% (three,596) 24.6% income tax (charges) credit score 3,305 (745) -- (19,142) -- net loss after earnings taxes (177,237) (125,972) 40.7% (225,460) -21.four% Loss from equity funding (874) (92) 850.0% (241) 262.7% net loss (178,111) (126,064) forty one.3% (225,701) -21.1% Accretion of pastime to non-controlling pastime holder (259) (13,394) -ninety eight.1% 846 -- Loss attributable to holders of ordinary shares (178,370) (139,458) 27.9% (224,855) (20.7%) Gross margin -88.three% -27.4% -9.0% operating margin -one hundred twenty.2% -44.four% -fifty five.9% web loss per regular share - basic (1) (0.01) (0.01) (0.01) net loss per ads - simple (0.40) (0.37) (0.61) net loss per normal share - diluted (1) (0.01) (0.01) (0.01) web loss per ads - diluted (0.40) (0.37) (0.61) Wafers shipped (in eight" wafers)(2) 168,682 323,175 (47.8%) 454,259 (62.9%) ability utilization 34.9% sixty seven.7% 92.1% word: (1) in accordance with weighted common common shares of 22,344 million (basic) and 22,344 million (diluted) in 1Q09, 18,948 million (fundamental) and 18,948 million (diluted) in 4Q08 and 18,579 million (fundamental) and 18,579 million (diluted) in 1Q08 (2) including copper interconnects (3) As restated in "SMIC experiences 2008 2nd Quarter results" issued on July 28, 2008 -- salary lowered to $146.5 million in 1Q09, down 46.2% QoQ from $272.5 million in 4Q08 and down 59.6% YoY from $362.4 million in 1Q08 as a result of decrease wafer shipments. -- charge of revenue reduced to $275.9 million in 1Q09, down 20.5% QoQ from $347.1 million in 4Q08, primarily because of a reduce in wafer shipments. -- Gross loss expanded to $129.four million in 1Q09, up 73.4% QoQ from $seventy four.6 million in 4Q08 and up 297.2% YoY from $32.6 million in 1Q08. -- Gross margins reduced to -88.three% in 1Q09 from -27.4% in 4Q08 essentially as a result of a big decrease in wafer shipments in addition to fab utilization QoQ. -- complete operating expenses elevated to $forty six.7 million in 1Q09 from $forty six.four million, an increase of 0.5% QoQ basically because of a decrease in executive R&D subsidies received in 1Q09. excluding international alternate gain, complete operating charges in 1Q09 became $52.6 million as compared to the 1Q09 advice of $53 million to $fifty six million. -- R&D prices increased to $18.5 million in 1Q09, up 47.7% QoQ from $12.5 million as a result of a lower in government subsidies acquired in 1Q09. except for the executive subsidies, R&D charges reduced by way of 6.2% due essentially to a lower in engineer scan related charges. -- G&A prices diminished to $14.9 million in 1Q09 from $sixteen.1 million in 4Q08 essentially because of an increase in the overseas alternate benefit linked to working actions, from $2.1 million in 4Q08 to $5.9 million in 1Q09. -- promoting & advertising prices lowered to $4.2 million in 1Q09, down 28.0% QoQ from $5.8 million in 4Q08. evaluation of Revenues sales evaluation by means of application 1Q09 4Q08 1Q08 computer 4.2% four.5% 12.8% Communications 50.9% 45.9% 54.three% buyer 32.9% 37.5% 25.9% Others 12.0% 12.1% 7.0% with the aid of carrier classification 1Q09 4Q08 1Q08 common sense (1) eighty five.3% eighty five.6% seventy eight.4% DRAM 2.8% 2.6% 12.1% administration functions four.1% 2.2% 2.5% masks Making, testing, others 7.8% 9.6% 7.0% through client type 1Q09 4Q08 1Q08 Fabless semiconductor businesses 70.9% sixty five.0% fifty four.4% built-in equipment producers (IDM) eleven.four% 15.2% 31.6% equipment corporations and others 17.7% 19.8% 14.0% by Geography 1Q09 4Q08 1Q08 North the united states 60.four% 59.9% fifty three.6% more desirable China (2) 32.three% 33.6% 27.7% Asia Pacific (three) 5.2% four.1% 6.1% Europe 2.1% 2.4% 12.6% Wafer earnings analysis with the aid of expertise 1Q09 4Q08 1Q08 0.065um 0.1% -- -- 0.09um 8.1% eleven.1% 19.eight% 0.13um 30.eight% 34.4% 25.0% 0.15um 0.eight% 2.2% four.2% 0.18um 31.5% 32.5% 32.1% 0.25um 0.4% 0.6% 0.5% 0.35um 28.three% 19.2% 18.four% be aware: (1) including 0.13mm copper interconnects (2) comprises Hong Kong and Taiwan (three) except for stronger China capability* Fab / (Wafer size) 1Q09 4Q08 Shanghai Mega Fab (8")(1) eighty five,000 88,000 Beijing Mega Fab (12")(2) 33,750 40,500 Tianjin Fab (8") 32,000 32,000 total month-to-month wafer fabrication means one hundred fifty,750 160,500 be aware: * Wafers per thirty days on the end of the duration in eight" wafers (1) Shanghai Mega Fab is now created from Fab 1, Fab 2, and Fab three (2) Beijing Mega Fab is now created from Fab four, Fab 5, and Fab 6 -- The exchange in capability is due essentially to a change in product mix. cargo and Utilization 8" equal wafers 1Q09 4Q08 1Q08 Wafer shipments including copper interconnects 168,682 323,one hundred seventy five 454,259 Utilization rate (1) 34.9% sixty seven.7% 92.1% word: (1) capacity utilization in accordance with complete wafer out divided by estimated capability -- Wafer shipments decreased 47.eight% QoQ to 168,682 devices of eight-inch equal wafers in 1Q09 from 323,one hundred seventy five devices of 8-inch equal wafers in 4Q08, and down sixty two.9% YoY from 454,259 eight-inch equal wafers in 1Q08. precise fiscal evaluation Gross income evaluation amounts in US$ heaps 1Q09 4Q08 QoQ 1Q08 YoY can charge of revenue 275,900 347,114 -20.5% 394,940 -30.1% Depreciation one hundred thirty,375 183,916 -29.1% 159,715 -18.4% other manufacturing costs 138,791 156,446 -eleven.three% 227,731 -39.1% Deferred cost amortization 5,886 5,886 -- 5,886 -- Share-based mostly compensation 848 866 -2.1% 1,608 -forty seven.3% Gross profit (129,381) (74,636) seventy three.three% (32,571) 297.2% Gross Margin -88.3% -27.four% -9.0% -- charge of sales diminished to $275.9 million in 1Q09, down 20.5% QoQ from $347.1 million in 4Q08, primarily because of a lower in wafer shipments. -- Gross loss multiplied to $129.four million in 1Q09, up 73.4% QoQ from $74.6 million in 4Q08 and up 297.2% YoY from $32.6 million in 1Q08. -- Gross margins diminished to -88.three% in 1Q09 from -27.4% in 4Q08 primarily because of a big reduce in wafer shipments in addition to fab utilization QoQ. working cost evaluation quantities in US$ lots 1Q09 4Q08 QoQ 1Q08 YoY complete working costs 46,681 46,445 0.5% one hundred seventy,151 -seventy two.6% analysis and development 18,494 12,524 forty seven.7% 34,233 -forty six.0% general and administrative 14,928 16,146 -7.5% 18,606 -19.eight% selling and marketing 4,208 5,843 -28.0% 4,884 -13.8% Amortization of intangible belongings 9,031 11,564 -21.9% 6,784 33.1% Impairment lack of long-lived assets -- 967 -- one hundred and five,774 -- Loss (income) from disposal of homes 20 (599) -- (one hundred thirty) -- -- total working charges extended to $46.7 million in 1Q09 from $46.4 million, a rise of 0.5% QoQ primarily as a result of a lessen in govt R&D subsidies bought in 1Q09. with the exception of international change profit, complete working charges in 1Q09 become $fifty two.6 million as in comparison to 1Q09 assistance of $fifty three million to $fifty six million. -- R&D charges expanded to $18.5 million in 1Q09, up 47.7% from $12.5 million because of a decrease in government subsidies obtained in 1Q09. with the exception of the govt subsidies, R&D prices diminished with the aid of 6.2% due basically to a lower in engineer scan linked costs. -- G&A costs reduced to $14.9 million in 1Q09 from $16.1 million in 4Q08 basically due to a rise within the foreign alternate gain connected to operating activities, from $2.1 million in 4Q08 to $5.9 million in 1Q09. -- promoting & marketing fees reduced to $4.2 million in 1Q09, down 28.0% QoQ from $5.8 million in 4Q08. other revenue (costs) amounts in US$ hundreds 1Q09 4Q08 QoQ 1Q08 YoY different profits (charges) (four,480) (4,146) eight.1% (3,596) 24.6% pastime salary 436 1,184 -63.2% 3,758 -88.four% pastime rate (5,498) (7,133) -22.9% (17,267) -68.2% overseas foreign money alternate profit (loss) (357) (2,543) -86.0% 10,317 -- other, internet 939 four,346 -78.4% (404) -- -- hobby profits declined in 1Q09 because of enormously lessen financial institution deposit rate. -- typical pastime expense decreased to $5.5 million in 1Q09 from $7.1 million in 4Q08 basically because of a lower usual mortgage stability and lower activity quotes; besides the fact that children, the effect changed into partially offset by means of lower executive hobby subsidies acquired in 1Q09. -- international exchange loss arising from non-operating activities lowered to $0.4 million in 1Q09 from $2.5 million in 4Q08. mixed with the international change gain coming up from working actions, the business recorded an overall overseas exchange benefit of $5.5 million in 1Q09 as in comparison to a international exchange loss of $0.four million in 4Q08. -- other, internet lowered to $0.9 million in 1Q09 from $4.3 million in 4Q08. Depreciation and Amortization -- total depreciation and amortization in 1Q09 turned into $207.eight million as in comparison to $207.7 million in 4Q08. Liquidity quantities in US$ lots 1Q09 4Q08 cash and money equivalents 502,016 450,230 constrained cash eleven,228 6,255 short term investments 20,732 19,928 debts receivable 156,177 199,372 inventory 154,783 171,637 Others seventy eight,728 seventy nine,437 complete current property 923,664 926,859 accounts payable a hundred thirty five,352 185,919 short-term borrowings 270,078 201,258 current component of lengthy-time period debt 359,080 360,629 Others one hundred forty four,146 151,967 complete existing liabilities 908,656 899,773 money Ratio 0.5x 0.5x short Ratio 0.7x 0.7x latest Ratio 1.0x 1.0x Capital structure amounts in US$ hundreds 1Q09 4Q08 cash and cash equivalents 502,016 450,230 constrained cash eleven,228 6,255 short-term funding 20,732 19,928 current portion of promissory note 29,493 29,242 Promissory note 23,792 23,590 short-term borrowings 270,078 201,258 present portion of long-term debt 359,080 360,629 lengthy-time period debt 533,090 536,518 total debt 1,162,248 1,098,405 Shareholders' fairness 2,573,891 2,749,365 total debt to equity ratio 45.2% 40.0% -- The raise in debt to equity ratio as of conclusion of 1Q09 is primarily due to a lessen in shareholders' fairness because of the net income loss recorded in 1Q09. cash flow amounts in US$ hundreds 1Q09 4Q08 net money from operating actions seventy eight,117 171,213 web cash from investing actions (81,785) (one hundred twenty,085) net money from financing activities fifty four,846 6,460 web exchange in cash 51,786 57,349 Capex summary -- Capital charges for 1Q09 had been $24 million as compared to the 1Q09 suggestions of $40 million to $45 million. -- total planned capital expenses for 2009 may be approximately $one hundred ninety million and may be adjusted in accordance with market conditions. recent Highlights and announcements -- FlipChip overseas, LLC, broadcasts 300mm Strategic Partnership with SMIC [2009-3-16] -- provide of alternate options [2009-2-17] -- extra Announcement [2009-2-10] -- alternate in Directorate [2009-2-5] -- SMIC reviews 2008 Fourth Quarter consequences [2009-2-5] -- excellent conventional assembly Held on February 3, 2009 poll consequences [2009-2-3] -- alternate in Directorate [2009-1-29] -- SMIC releases preliminary edition of three 65-nanometer regular mobilephone Libraries [2009-1-21] -- be aware of wonderful typical meeting [2009-1-15] -- Letter to Shareholders: website notification letter [2009-1-15] -- Non-Exempt carrying on with connected Transactions and Refreshment of regular Mandate to Allot and concern Shares [2009-1-15] -- change in Directorate [2009-1-14] -- Closure of Register of contributors [2009-1-12] -- Notification of Board meeting [2009-1-9] -- SMIC (NYSE: SMI, SEHK: 981) Schedules Fourth Quarter 2008 Webcast convention name [2009-1-9] -- Non-Exempt carrying on with related Transactions [2009-1-8] -- atypical increase in Share buying and selling price [2009-1-7]
Please consult with SMIC's site at http://www.smics.com/website/enVersion/Press_Center/pressRelease.jsp for further particulars related to the contemporary announcements.Semiconductor Manufacturing overseas organisation CONSOLIDATED stability SHEET (In US bucks) As of the end of March 31, December 31, 2009 2008 (Unaudited) (Unaudited) assets latest assets: cash and cash equivalents 502,015,857 450,229,569 restricted money 11,227,741 6,254,813 brief-term investments 20,731,562 19,928,289 accounts receivable, internet of allowances of $5,870,986 and $5,680,658 at March 31, 2009 and December 31, 2008, respectively 156,177,a hundred and sixty 199,371,694 Inventories 154,783,494 171,636,868 pay as you go price and other latest assets 57,287,558 56,299,086 Receivable for sale of manufacturing machine 21,440,494 23,137,764 total present property 923,663,866 926,858,083 Land use rights, net 79,234,650 74,293,284 Plant and machine, web 2,792,875,058 2,963,385,840 acquired intangible property, internet 191,028,492 200,059,106 Deferred can charge, net 41,205,077 47,091,516 equity investment 10,756,777 11,352,186 different lengthy-time period prepayments 1,486,807 1,895,337 Deferred tax property fifty one,969,380 forty five,686,470 total belongings 4,092,220,107 4,270,621,822 LIABILITIES AND STOCKHOLDERS' fairness latest liabilities: Account payable a hundred thirty five,351,888 185,918,539 gathered prices and other current liabilities 114,185,387 122,173,803 brief-term borrowings 270,078,251 201,257,773 latest portion of promissory notes 29,492,873 29,242,001 current element of long-term debt 359,079,883 360,628,789 earnings tax payable 467,869 552,006 total present liabilities 908,656,151 899,772,911 long-term liabilities: Promissory notes 23,792,341 23,589,958 lengthy-time period debt 533,090,173 536,518,281 lengthy-time period payables concerning license agreements 18,375,736 18,169,006 Deferred tax liabilities 373,727 411,877 complete lengthy-time period liabilities 575,631,977 578,689,122 total LIABILITIES 1,484,288,128 1,478,462,033 Non-controlling hobby 34,040,748 forty two,795,288 Commitments Stockholders' fairness: usual shares $0.0004 par value, 50,000,000,000 shares approved, shares issued and astonishing 22,350,521,609 and 22,327,784,827 at March 31, 2009 and December 31, 2008, respectively eight,940,209 8,931,114 extra paid-in capital three,491,661,468 3,489,382,267 collected different complete (loss) salary 169,290 (439,123) gathered deficit (926,879,736) (748,509,757) total stockholders' fairness 2,573,891,231 2,749,364,501 complete LIABILITIES AND STOCKHOLDERS' fairness four,092,220,107 four,270,621,822 Semiconductor Manufacturing foreign service provider CONSOLIDATED observation OF OPERATIONS (In US dollars) For the three months ended March 31, December 31, 2009 2008 (Unaudited) (Unaudited) earnings 146,518,884 272,478,762 cost of income 275,899,824 347,114,296 Gross loss (129,380,940) (74,635,534) working expenses (salary): research and development 18,494,784 12,523,835 prevalent and administrative 14,927,735 16,146,415 selling and advertising and marketing four,207,593 5,843,252 Amortization of acquired intangible property 9,030,614 eleven,563,678 Impairment lack of long-lived belongings -- 966,667 Loss (revenue) from sale of machine and other fixed assets 20,484 (598,819) total working expenses, internet forty six,681,210 forty six,445,028 Loss from operations (176,062,150) (121,080,562) other earnings (expense): hobby revenue 436,294 1,183,576 pastime price (5,498,154) (7,132,535) foreign foreign money change benefit loss (357,034) (2,542,966) Others, net 938,969 4,346,182 complete different cost, net (4,479,925) (4,one hundred forty five,743) Loss before income tax (one hundred eighty,542,075) (a hundred twenty five,226,305) income tax benefit (fee) three,304,513 (745,310) Loss from equity investment (873,513) (92,319) net loss (178,111,075) (126,063,934) Accretion of activity to non-controlling pastime holder (258,904) (13,394,087) Loss because of holders of regular shares (178,369,979) (139,458,021) internet loss per share, primary (0.01) (0.01) net loss per ads, basic (0.40) (0.37) internet loss per share, diluted (0.01) (0.01) net loss per advertisements, diluted (0.forty) (0.37) normal shares utilized in calculating primary loss per normal share 22,343,640,476 18,947,602,493 usual shares utilized in calculating diluted loss per standard share 22,343,640,476 18,947,602,493 Semiconductor Manufacturing international agency CONSOLIDATED remark OF money FLOWS (In US bucks) For the three months ended March 31, December 31, 2009 2008 (Unaudited) (Unaudited) working activities net loss (178,111,075) (126,063,934) adjustments to reconcile internet income (loss) to web money provided by using working actions: Deferred tax (6,321,059) (1,924,575) Loss (income) from sale of machine and other fastened belongings 20,484 (598,820) Depreciation and amortization 196,535,950 193,779,737 Amortization of received intangible property 9,030,614 11,563,678 Share-based compensation 2,272,359 2,358,942 Non-cash interest price on promissory be aware and lengthy-time period payable touching on to license agreements 1,046,426 1,480,674 Loss from equity funding 873,513 92,320 Impairment lack of lengthy-lived belongings -- 966,667 changes in working property and liabilities: debts receivable, net 43,194,535 86,502,133 Inventories 16,853,373 61,385,789 prepaid cost and different present assets (579,942) (5,798,143) debts payable (6,456,221) (36,579,576) accumulated costs and different latest liabilities (158,281) (15,985,881) salary tax payable (84,138) 34,327 web money supplied via working actions seventy eight,116,538 171,213,338 Investing activities: buy of plant and machine and land use rights (seventy two,018,394) (129,327,507) Proceeds from executive furnish to buy plant and gadget 6,437,831 4,181,922 Proceeds from sale of device 1,700,577 913,738 Proceeds received from sale of belongings held for sale 770,931 -- Purchases of got intangible assets (12,621,260) (23,315,762) purchase of brief-term investments (31,496,963) -- purchase of equity investment (278,103) -- Sale of brief-term investments 30,693,690 30,717,248 alterations in restricted cash (4,972,928) (3,254,813) web money used in investing actions (eighty one,784,619) (120,085,174) Financing actions: Proceeds from short-time period borrowing 182,644,921 57,407,359 compensation of brief-time period borrowings (113,824,443) (sixty eight,750,000) Proceeds from long-time period debt -- 39,397,a hundred forty five repayment of long-term debt (four,977,014) (174,736,605) compensation of promissory notes -- (15,000,000) Proceeds from issuance of typical shares -- 168,100,000 Proceeds from activity of worker stock alternate options 15,937 42,307 Redemption of non-controlling interest (9,013,444) -- internet cash provided by way of financing actions 54,845,957 6,460,206 impact of alternate price adjustments 608,412 (239,821) internet boost (lessen) IN cash AND cash EQUIVALENTS fifty one,786,288 fifty seven,348,549 money AND cash EQUIVALENTS, beginning of period 450,229,569 392,881,020 cash AND cash EQUIVALENTS, conclusion of length 502,015,857 450,229,569 Investor Contacts: En-Ling Feng Tel: +86-21-3861-0000 x16275 electronic mail: [email protected] Anne Wong Chen Tel: +86-21-3861-0000 x12804 e mail: [email protected] Edith Kwan Tel: +852-2116-2624 e-mail: [email protected]
supply Semiconductor Manufacturing international organization
IBM has radically more desirable the bang for the buck on its Power7-based energy systems 701 and 702 blade servers this week, and is expected to soon deliver in a similar fashion priced entry rack and tower servers. And now it has a brand new, lower-can charge AIX 6.1 specific version in order to match the much less costly hardware and for this reason assist big Blue's AIX platform improved compete against home windows, Linux, HP-UX, and Solaris alternatives.
the brand new AIX specific version takes the special reasonably priced pricing that became purchasable best on JS series blade servers and now makes it purchasable throughout the power systems line, together with logical partitions on the largest vigor 595 (and earlier than too long vigor 595) servers.
With the express edition, IBM is losing the cost by way of just about half, but is making the version on relevant for smaller machines and lighter workloads. it could only scale throughout 4 cores in a single system picture and most effective enables 8 GB of leading reminiscence to be allotted in each and every core the usage of the PowerVM hypervisor.
by contrast, the regular AIX 6.1 license, known as standard version, can scale up to sixty four cores and 128 threads and has no limits on the volume of memory that can be allotted to a core the use of PowerVM. AIX 6.1 common edition also contains PowerVM Workload Partitions manager, the dynamic allocation device for the hypervisor, and its live application Mobility function, which enables for operating AIX functions to be transported from one physical AIX field to a different one.
common edition additionally includes Micro Partitioning, which enables a single core to host as many as 10 logical partitions, an encrypted JFS2 file device, relied on AIX security extensions, dynamic tracing with a function called ProbeVue, and a few other points.
IBM rolled up AIX 6.1 business version returned in September 2008, adding in workload partitions (WPARs, which is IBM's riff on virtual inner most server), plus a bunch of programs management equipment - Tivoli software Dependency Discovery supervisor, Tivoli Monitoring, and utilization and Accounting manager Virtualization edition for vigour techniques - to assist large AIX stores retain track of who is doing what.
AIX 6.1 EE now contains methods Director enterprise edition, too, and may eventually scale to 256 cores. at the moment, AIX 6.1 tops out at 64 cores and 128 threads, however when AIX 7.1 EE comes out later q4, it will span 256 cores and 1,024 threads (as far as the preliminary Power7 servers are expected to head). AIX 6.1 may be tweaked to aid sixty four cores and 256 threads in a single picture, which capability in case you need to use greater than a quarter of the future power 795 in a single graphic, you should improve to AIX 7.1 EE.
Ian Jarman, supervisor of power programs application at IBM, says the express edition pricing will vary based on the dimension of the server--the use of the small, medium, and large classes that the enterprise is beginning to use for a lot of its energy systems working systems and connected programs application.
On a small energy techniques desktop the use of Power7 processors, AIX 6.1 categorical costs $300 per core, plus $seventy five for a year of utility upkeep (what IBM calls SWMA, or "swamma") for 9x5 company hours. On a medium computer, the license expenses $800 per core and SWMA expenses $200 for primary SWMA, and on a big computer, the express edition of AIX 6.1 prices $1,500 per core plus $375 per 12 months for SWMA.
The price of AIX 6.1 specific edition carefully follows the particular AIX pricing on blade servers, which ran to $85 per core plus $299 for a year of preservation. The long-time period charge is decrease with the new categorical version pricing, youngsters, considering that the annual assist can charge is a lot lessen now. shoppers pay for this change by way of having a crimped edition of AIX, of direction, however the particular low in cost AIX licensing now applies to all machines, not just blades.
That potential purchasers can greater effortlessly have the funds for to do AIX consolidations (or port Solaris and HP-UX infrastructure workloads with modest CPU and reminiscence requirements) on larger iron.
consumers with older Power5 and Power6 machines will additionally pay a top class for AIX 6.1, even with edition. It charges $375 per core for a license to AIX 6.1 categorical version on a small Power7 container, and the expense is the same on a small Power6 container. however with AIX 6.1 average edition, a small computer expenses $625 per core including SWMA with Power7 chips, however expenses $849 per core for regular version.
For AIX 6.1 commercial enterprise version on small machines, a license costs $988 per core (including on year of common SWMA), but expenses $1,212 on small Power6 machines. Roughly the same rate differential holds on medium and large vigor systems machines evaluating Power6 and Power7 packing containers.
basically, in case you are looking to spend much less on both hardware and programs software, movement to Power7. ®
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25. Edmonton Oilers (ultimate week: 28)
After an extended dropping streak, the Oilers' checklist has more desirable dramatically, with the club winning five of its ultimate eight video games. it be fair to ask how tons of it is as a result of a stronger efficiency at a team stage, though, and how a good deal of the credit may still go to goalie Cam Talbot. Talbot changed into in internet for all 5 wins, posting keep percentages of .973, .969, 1.000, .975 and .967. he's received just two video games all yr wherein he surrendered more than two dreams.
24. Vancouver Canucks (closing week: 25)
The Vancouver Canucks have received two straight and three of four, wins that should be encouraging to the crew's coaches and players but that are also pushing it up the standings at a time when the playoffs are already out of attain and a worse finish might secure a more robust draft prefer in the summer.
Rookie defenceman Ben Hutton had assists in every of Vancouver's wins, inserting up 4 aspects in all; he has seven in his final eight contests and is constantly taking part in greater than 20 minutes per game.
23. Arizona Coyotes (closing week: 23)
The Arizona Coyotes started the week with losses to Colorado and Vancouver but finished strongly, dispatching the Flames four-1 on Friday and enhancing the score to four-0 in Edmonton here evening. Louis Domingue has played stronger of late after a lengthy stoop, whereas Antoine Vermette picked up five features in these final two games and has nine in his remaining 5 contests.
22. Ottawa Senators (final week: 20)
The Ottawa Senators snapped a 3-video game dropping streak with a 4-0 win over Toronto on Saturday, but with seven facets separating the Sens from the final wild-card spot within the East, that victory turned into actually too little, too late. Defenceman Dion Phaneuf is pointless in six video games after deciding on up seven aspects in his first 10 video games with the group.
21. Montreal Canadiens (ultimate week: 22)
Goaltender Mike Condon is playing smartly, and centre Alex Galchenyuk may be the most well liked player in the NHL, having scored 11 times in his final nine video games. Galchenyuk has matched his career-excessive of forty six features, and with 25 goals he has eclipsed his outdated most reliable complete (20). The team won two of three video games on the week.
by a news Reporter-body of workers news Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by way of the inventors Hartmann, Samuel (Staufen, CH); Guillon, David (Vorderthal, CH); Hajas, David (Rupperswil, CH); Thut, Markus (Seon, CH), filed on July 2, 2015, turned into published on-line on April 17, 2018.
The patent's assignee for patent number 9949385 is ABB Schweiz AG (Baden, CH).
news editors got here quote from the history information supplied by using the inventors: "apart from a housing, semiconductor modules might also encompass a metallized substrate (e.g., manufactured from ceramic), to which semiconductor chips are connected, and electrical terminals, in which the semiconductor module or its chips may also be electrically related to extra add-ons. These electrical terminals, that are generally made out of copper, may additionally, for instance, be related to the steel layer of the substrate with the aid of capability of ultrasonic welding.
"right through the ultrasonic welding of copper terminals to the substrate, particles could be produced that may result in difficulties in the event that they continue to be at critical elements in the module, reminiscent of contacts of the semiconductor chips or on the insulating ceramic, as an instance.
"seeing that these particles are likely to reside attached to polymeric substances, corresponding to polyimides, as an example, it may well be tricky to remove the particles from the module after the welding operation.
"it's feasible to enclose the particles within the vicinity across the foot of the terminal through an appropriate housing, but the metalized terminal welding aspect would should be designed to be very massive for this to permit an enclosing structure to be placed on it.
"If the enclosing structure had been positioned onto the insulating ceramic, it might in the reduction of its insulating effect. in addition, it can be that a relocating plastic half tears away the encompassing silicone gel from the metal and from the ceramic, which could impair the insulation.
"WO 2014 000 975 A1 describes, as an instance, a method for ultrasonically welding terminal features to a substrate for electronic accessories in which the welding aspect is enclosed all over the welding operation by way of a structure this is supposed to steer clear of particles that could be produced all over the welding operation from contaminating the substrate.
"JP 2010 040 615 A2 proposes to stay away from particles produced all through ultrasonic welding from contaminating a semiconductor machine. For this purpose, a plastic is utilized across the welding point.
"It has additionally been proposed to perform the ultrasonic welding within a foam, it then being feasible for the particles produced to be washed away along side the froth after the welding. This frequently leads, to a cost-intensive creation process.
"U.S. Pat. No. four,970,618 describes a laptop disk with a housing that is ultrasonically welded and has portions which control an air circulation when the magnetic disk rotates, to be able to stay away from that particles produced throughout the ultrasonic welding can attain the disk."
As a complement to the heritage suggestions on this patent, VerticalNews correspondents additionally received the inventors' abstract information for this patent: "An exemplary embodiment of the present disclosure offers a semiconductor module which comprises a base plate, and a substrate on the base plate. The substrate has a metallization on at the least one facet and carrying at least one semiconductor chip. The exemplary semiconductor module also comprises a housing which is connected to the bottom plate and which as a minimum partially encloses the substrate. additionally, the exemplary semiconductor module includes at the least one terminal having one end which protrudes from the housing and a further end which has a terminal foot. The terminal foot is attached on a terminal pad of the metallization with the aid of ability of ultrasonic welding. The housing has a defensive wall which encloses the terminal and divides an indoors house of the housing into an unprotected place and a included region. The shielding wall is formed such that a spot is formed between the substrate and the protective wall, the gap being organized to carry a fluid circulation such that particles produced all through the ultrasonic welding of the terminal foot to the terminal pad are avoided from penetrating into the blanketed place from the unprotected area.
"An exemplary embodiment of the current disclosure gives a way for producing a semiconductor module. The exemplary formulation includes offering a semiconductor module having a base plate, a substrate on the base plate, and a housing which is connected to the base plate and as a minimum partially enclosing the substrate, where the substrate has a metallization on at least one aspect and carrying as a minimum one semiconductor chip. The exemplary system also includes putting a terminal foot of a terminal on a terminal pad of the substrate it truly is surrounded through a shielding wall of the housing, the protecting wall dividing an interior space of the housing into an unprotected place and a blanketed region. furthermore, the exemplary formula includes inserting a sonotrode on the terminal foot and ultrasonically welding the terminal foot to the substrate. further, the exemplary formula comprises producing a fluid move in a spot between the protective wall and the substrate from the included area into the unprotected location in order that particles produced all through the ultrasonic welding are avoided from passing from the unprotected location into the covered vicinity."
For additional information on this patent, see: Hartmann, Samuel; Guillon, David; Hajas, David; Thut, Markus. Semiconductor Module with Ultrasonically Welded Terminals. U.S. Patent quantity 9949385, filed July 2, 2015, and posted online on April 17, 2018. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtmlp.c2FPTOpercent2Fsrchnum.htm&r=1&f=G&l=50&s1=9949385.PN.&OS=PN/9949385RS=PN/9949385
keyword phrases for this news article encompass: Europe, business, Electronics, Switzerland, Semiconductor, ABB Schweiz AG.
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